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Universal Aluminium Heat sink for Chip IC (40 x 40 x 11 mm)

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10 In stock


109.00 (excluding 18% GST)

10 In stock

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Description

The Universal Aluminum Heat Sink for Chip IC (40 x 40 x 11 mm) is a medium-sized heat sink designed to cool integrated circuits (ICs), transistors, voltage regulators, and other semiconductor devices. Made from high-quality aluminum, it efficiently dissipates heat to ensure stable operation and prevent overheating of components. With a compact footprint and a height of 11 mm, it is suitable for ICs in various electronic circuits where space is limited but effective cooling is essential.v

Features

  • Efficient Heat Dissipation: The finned design increases the surface area, enabling faster and more efficient heat transfer from the IC.
  • High-Quality Aluminum: Constructed from lightweight aluminum, providing excellent thermal conductivity and corrosion resistance.
  • Universal Fit: The 40 x 40 mm size makes it compatible with a wide variety of IC packages, transistors, and other semiconductors.
  • Compact Design: At 11 mm height, the heat sink is compact enough to fit in most enclosures without sacrificing cooling efficiency.
  • Durable Build: Sturdy construction ensures long-lasting thermal management even in demanding applications.

Specifications

  • Dimensions:
    • Length: 40 mm
    • Width: 40 mm
    • Height: 11 mm
  • Material: Aluminum (high thermal conductivity and lightweight)
  • Weight: Lightweight, designed for minimal impact on the overall device weight.
  • Thermal Resistance: Typically around 5°C/W to 10°C/W, depending on airflow and environmental conditions.
  • Mounting Type: Can be attached using thermal adhesive, thermal tape, or paste. May also include mounting holes for screws, depending on the specific model.
  • Surface Finish: Anodized (usually black or silver) for improved heat dissipation and protection against corrosion.

Note

* Product Images are shown for illustrative purposes only and may differ from actual product

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