Description
The Heat Sink – TO3 Package – 40mm is designed to provide efficient thermal management for TO-3 packaged components, which are commonly used in high-power applications such as audio amplifiers, power transistors, and voltage regulators. With a height of 40 mm, this heat sink offers ample surface area for effective heat dissipation, ensuring that critical components maintain optimal operating temperatures. Its robust construction and efficient design make it a reliable choice for various electronic applications.
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