Description
The Heat Sink – TO220 Package – PI51 – 40mm is designed to provide effective thermal management for components housed in TO-220 packages, including voltage regulators, power transistors, and MOSFETs. With a height of 40 mm, this heat sink offers a substantial surface area to dissipate heat efficiently, ensuring reliable performance in high-power applications. The PI51 design features a finned structure for enhanced airflow and cooling, making it ideal for various electronic devices that require robust thermal solutions.
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