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Heat Sink – TO220 Package – PI51 – 40mm

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Description

The Heat Sink – TO220 Package – PI51 – 40mm is designed to provide effective thermal management for components housed in TO-220 packages, including voltage regulators, power transistors, and MOSFETs. With a height of 40 mm, this heat sink offers a substantial surface area to dissipate heat efficiently, ensuring reliable performance in high-power applications. The PI51 design features a finned structure for enhanced airflow and cooling, making it ideal for various electronic devices that require robust thermal solutions.

Features

  • Designed for TO-220 Packages: Specifically tailored to fit TO-220 components, ensuring optimal contact and heat dissipation.
  • Efficient Cooling Design: The 40 mm height increases the surface area for effective heat dissipation, allowing for cooler operation of the device.
  • High-Quality Aluminum Construction: Made from durable aluminum, which provides excellent thermal conductivity and corrosion resistance.
  • Easy Installation: Can be securely mounted using clips or screws, facilitating quick installation onto TO-220 devices.
  • Compact Profile: The design remains compact, making it suitable for applications with limited space while still providing effective cooling.

Specifications

  • Dimensions:
    • Height: 40 mm
    • Width: Typically around 25 mm (specific models may vary)
    • Thickness: Generally between 5-10 mm
  • Material: High-quality aluminum for optimal thermal performance.
  • Thermal Resistance: Typically ranges from 5°C/W to 10°C/W, depending on the airflow and specific application conditions.
  • Mounting Options: Compatible with standard mounting methods, including clips or screws for easy attachment to TO-220 components.
  • Surface Finish: Anodized or polished finish to enhance thermal efficiency and protect against corrosion.

Note

* Product Images are shown for illustrative purposes only and may differ from actual product

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