Description
This heat sink is designed for components in the PI48 package, providing efficient thermal management for high-performance electronics. With dimensions of 25 mm x 24 mm x 16 mm, this heat sink is optimized to fit components in the PI48 package, helping to dissipate excess heat generated during operation. Made from high-quality aluminum, it offers excellent thermal conductivity, ensuring that heat is transferred away from the component and into the surrounding environment effectively.
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